MECHANIC XG-50 Solder Paste is a professional quality tin cream solder paste for soldering of SMD components, rework of BGA, assembling of printed circuit boards (PCB), prototyping, and electronics repair purposes. The solder paste is based on Sn63/Pb37 solder alloy and has a melting point of about 183°C, providing a good solder flow and strong joints under reflow or hot air soldering. It is especially handy for repairmen soldering small SMD components with the need for accurate application of solder. The solder paste can be simply applied to solder pads of PCB prior to the soldering using reflow oven or hot air soldering equipment. The 3# particle size of solder paste is ideal for precision SMD soldering applications, whereas IPX3 flux composition is helpful in obtaining good solder wetting. The paste is supplied in sealed original MECHANIC packaging, which is very convenient for electronics repair workshops, repairmen, hobbyists, and prototyping
✅ Key Features
✔ Original MECHANIC XG-50 solder paste 35g
✔ Sn63/Pb37 solder alloy
✔ Melting temperature: 183°C
✔ 3# solder particle size
✔ IPX3 flux
✔ Suitable for SMD component soldering
✔ Ideal for BGA rework and PCB assembly
✔ Low-dross soldering performance
✔ Suitable for reflow oven and hot-air stations
✔ Sealed original packing
✔ Convenient for repair and prototyping work
✅ Suitable For
- Mobile Phone Repair
- Laptop Repair
- Desktop Computer Repair
- Printer Repair & Maintenance
- PCB & Circuit Board Soldering
- Electronic Component Repair
- DIY Electronics Projects
- Home Appliance Repair
- Electrical Work
- Technical Training & Workshops
1. It is dangerous to inhale and if ingested.
2. There is a possibility of cumulative effect.
3. Do not bring near food, beverages, and animal food.
4. While applying do not eat, drink or smoke.
5. Do not come into prolonged contact with the skin with solder paste. If there is an ingestion of solder paste consult a physician immediately.
6. Keep the container tightly closed and cool.








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